Microdermabrasion - A gentle way to softer skin

The DiamondTome Wand removes this layer of skin by gently exfoliating the skin natural diamond chips, while at the same time vacuuming the dead skin cells away in a sterile and controlled manner. Removing this outer layer of dead skin cells leaves a smoother texture and promotes the growth of healthy new skin cells.

Microdermabrasion using a DiamondTome Wand is similar to particle microdermabrasion and chemical but without the adverse effects of loose particles, irritation and skin reaction. Unlike other treatments, the DiamondTome Skin Resurfacing System uses no loose abrasives to contaminate you or the environment.

The Advantages of DiamondTome Wands

 

Microdermabrasion is a wonderful addition to laser or chemical peels because it is non-invasive, non-surgical and requires no down time after treatment. Your skin will have a radiant glow, free of irritation and loose particles. Patients experience softer, smoother and cleaner skin after the first treatment. Treatment series vary from four to ten sessions depending on the condition being treated and the type of skin.

How much discomfort will I experience?

 

Microdermabrasion treatments using the DiamondTome System are painless yet effective.  Most patients sleep through the procedure because it is so enjoyable. The degree of effectiveness is controlled by a widely adjustable vacuum in conjunction with the carrying coarseness of the DiamondTome Wands. Your skin care professional is trained to evaluate the effectiveness of the treatment while at the same time ensuring your comfort. Leading plastic surgeons and dermatologists regard the DiamondTome System as being more gentle than other exfoliating systems, even at its highest settings.

How will I look after the treatment?

 

Your skin may look slightly flushed immediately after the treatment but should return to normal in 10-30 minutes. Your skin will look and feel smoother even after the first treatment and will continue to improve with additional treatments.